BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

摘要

This paper outlines the issues related to RF MEMS packaging and low actuationvoltage. An original approach is presented concerning the modeling ofcapacitive contacts using multiphysics simulation and advancedcharacterization. A similar approach is used concerning packaging developmentwhere multi-physics simulations are used to optimize the process. A devotedpackage architecture is proposed featuring very low loss at microwave range.